Invention Grant
US08845812B2 Method for contamination removal using magnetic particles 有权
使用磁性颗粒去除污染物的方法

Method for contamination removal using magnetic particles
Abstract:
Methods and apparatus are provided for cleaning a substrate (e.g., wafer) in the fabrication of semiconductor devices utilizing a composition of magnetic particles dispersed within a base fluid to remove contaminants from a surface of the substrate.
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