发明授权
- 专利标题： Mold for fabricating barrier rib and method of fabricating two-layered barrier rib using same
- 专利标题（中）： 用于制造隔壁的模具和使用其制造两层隔壁的方法
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申请号： US13592978申请日： 2012-08-23
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公开(公告)号： US08846159B2公开(公告)日： 2014-09-30
- 发明人: Han Sol Cho , Yong Young Park , Joon Yong Park , Young Mok Son
- 申请人： Han Sol Cho , Yong Young Park , Joon Yong Park , Young Mok Son
- 申请人地址： KR Suwon-Si, Gyeonggi-Do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-Si, Gyeonggi-Do
- 代理机构： Buchanan Ingersoll & Rooney PC
- 优先权： KR2004-97649 20041125
- 主分类号： C08J7/04
- IPC分类号： C08J7/04 ; B05D3/00 ; C08J7/18 ; G21H5/00 ; B05D3/06 ; A01J21/00 ; G02F1/1335 ; H01J9/24
摘要：
The disclosed mold includes recessed parts which have a shape corresponding to embossed portions of the barrier rib to be fabricated, and protruding parts which have a shape corresponding to depressed portions of the barrier rib to be fabricated, protrude adjacent to the recessed parts, and are tapered. The protruding parts and the recessed parts are arranged at regular intervals. It is possible to simply fabricate the two-layered barrier rib for inkjet application through a single embossing process at low cost using the mold for fabricating the barrier rib of the present invention.
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