Invention Grant
- Patent Title: Thermal expansion control employing platelet fillers
- Patent Title (中): 使用血小板填充剂的热膨胀控制
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Application No.: US13649760Application Date: 2012-10-11
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Publication No.: US08846191B2Publication Date: 2014-09-30
- Inventor: Gareth G. Hougham , Xiao H. Liu
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Louis J. Percello, Esq.
- Main IPC: B32B27/00
- IPC: B32B27/00 ; C08L63/00

Abstract:
Bilayer platelet fillers are employed to compensate for a positive coefficient of thermal expansion (CTE) of an embedding polymeric material, or even to provide a composite structure having a negative CTE to eliminate or alleviate thermomechanical stress and/or delamination during thermal cycling. A bilayer platelet includes two joined layers having different CTEs. The CTE mismatch induces bending of the bilayer platelets, thereby causing cavities at temperatures lower than the joining temperature at which the bilayers are joined. The decrease in the volume of the polymeric material and the bilayer platelets at low temperatures is compensated by an accompanying increase in the volume of the cavities so that the composite structure has a temperature independent volume, a low net CTE, or even a negative CTE.
Public/Granted literature
- US20130035411A1 THERMAL EXPANSION CONTROL EMPLOYING PLATELET FILLERS Public/Granted day:2013-02-07
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