An analysis apparatus for a printed circuit board. The analysis apparatus includes a processor that executes a process of rewriting physical property data of a wiring layer of a printed circuit board to a value. The value is based on physical property data of an electronic part having a heat-generating attribute. The electronic part is mounted on the portion of the wiring layer. The analysis apparatus converts the physical property data of the portion of the wiring layer that has the electronic part to physical property data of an insulating layer of the printed circuit board.