Invention Grant
- Patent Title: Manufacturing method for a heating resistor element
- Patent Title (中): 加热电阻元件的制造方法
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Application No.: US13397900Application Date: 2012-02-16
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Publication No.: US08850691B2Publication Date: 2014-10-07
- Inventor: Keitaro Koroishi , Toshimitsu Morooka , Noriyoshi Shoji , Yoshinori Sato , Norimitsu Sanbongi
- Applicant: Keitaro Koroishi , Toshimitsu Morooka , Noriyoshi Shoji , Yoshinori Sato , Norimitsu Sanbongi
- Applicant Address: JP
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP
- Agency: Brinks Gilson & Lione
- Priority: JP2007-275570 20071023; JP2008-218636 20080827
- Main IPC: H05B3/00
- IPC: H05B3/00 ; H05B3/16 ; B41J2/335

Abstract:
A manufacturing method for a heating resistor element includes a concave portion forming step, a bonding step and a resistor forming step. The concave portion forming step includes forming a concave portion on at least one of bonded surfaces between an insulating substrate and a heat accumulating layer. The bonding step causes the bonded surfaces between the insulating substrate and the heat accumulating layer to adhere to each other to bond the insulating substrate and the heat accumulating layer. The resistor forming step includes forming a heating resistor at a position on the heat accumulating layer. The position is opposed to the concave portion. The concave portion forming step further includes processing an inner surface of the concave portion on a side of the insulating substrate to have surface roughness Ra of 0.2 μm or more.
Public/Granted literature
- US20120144659A1 HEATING RESISTOR ELEMENT, MANUFACTURING METHOD FOR THE SAME, THERMAL HEAD, AND PRINTER Public/Granted day:2012-06-14
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