A method is provided for the sealed assembly of an electronic housing containing one or more electronic components. The method includes: assembling the housing by bringing a support, to which the electronic components are fixed, in contact with a cover by means of a mixture-including a paste and nanoparticles in suspension in the paste. The size of the nanoparticles range from 10 to 30 nm. The housing is closed in a sealed manner by heating the housing to a temperature T of between 150° C. and 180° C. making it possible to sinter the metal nanoparticles, while subjecting the housing to a pressure greater than 2.5×105 Pa.