Invention Grant
- Patent Title: Device and system for excavating and backfilling soil
- Patent Title (中): 挖土和回填土的装置和系统
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Application No.: US13215570Application Date: 2011-08-23
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Publication No.: US08850725B2Publication Date: 2014-10-07
- Inventor: Rigoberto Hernandez
- Applicant: Rigoberto Hernandez
- Applicant Address: US FL North Palm Beach
- Assignee: RHL Holdings, LLC
- Current Assignee: RHL Holdings, LLC
- Current Assignee Address: US FL North Palm Beach
- Agency: McHale & Slavin, P.A.
- Main IPC: E02F1/00
- IPC: E02F1/00 ; E02F5/12

Abstract:
A trench edging member to be placed adjacent a trench or hole in the ground is designed to retain the soil removed from the trench, not destroy the landscape beneath the device, and enable an individual to readily replace the soil back into the trench or hole. A plurality of these devices can be placed adjacent each other so that a long trench can be dug filled with the required equipment or utilities, and the soil replaced back into the trench. The material employed for the device is formed into an undulating or wavy pattern when viewed in cross section. This enables a plurality of the devices to be nested or stacked atop one another for storage and/or transportation. The undulations also add rigidity to the device without adding weight to the device.
Public/Granted literature
- US20120047778A1 Device And System For Excavating And Backfilling Soil Public/Granted day:2012-03-01
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