Invention Grant
- Patent Title: Heat pump type speed heating apparatus
- Patent Title (中): 热泵式加热装置
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Application No.: US13091513Application Date: 2011-04-21
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Publication No.: US08850837B2Publication Date: 2014-10-07
- Inventor: Noma Park , Heewoong Park , Hwanjong Choi
- Applicant: Noma Park , Heewoong Park , Hwanjong Choi
- Applicant Address: KR Seoul
- Assignee: LG Electronics Inc.
- Current Assignee: LG Electronics Inc.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates, LLP
- Priority: KR10-2010-0038005 20100423
- Main IPC: F25B13/00
- IPC: F25B13/00 ; F25B7/00 ; F25B30/02 ; F24D19/10 ; F25B40/04

Abstract:
A heat pump type speed heating apparatus, comprising: a cooling cycle circuit to circulate a first refrigerant to operate air conditioning, the cooling cycle circuit including a compressor, an outdoor heat exchanger, an expansion apparatus, and an indoor heat exchanger, a hot water supply compressor to compress a second refrigerant, a hot water supply heat exchanger to condense the compressed second refrigerant and to heat water, a hot water supply expansion apparatus to expand the second refrigerant from the hot water supply heat exchanger, and a cascade heat exchanger, connected to the cooling cycle circuit, to evaporate the second refrigerant expanded at the hot water supply expansion apparatus, and the first refrigerant to undergo condensation, expansion, and evaporation in the cooling cycle circuit.
Public/Granted literature
- US20110259024A1 HEAT PUMP TYPE SPEED HEATING APPARATUS Public/Granted day:2011-10-27
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