Invention Grant
- Patent Title: Die cushion device
- Patent Title (中): 模具缓冲装置
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Application No.: US12989451Application Date: 2009-05-07
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Publication No.: US08850865B2Publication Date: 2014-10-07
- Inventor: Takuji Miyasaka , Hirohide Sato , Shigeo Morimoto , Hiroyuki Ito , Takeo Arikabe , Shyoji Watanabe , Shigenori Nagashima
- Applicant: Takuji Miyasaka , Hirohide Sato , Shigeo Morimoto , Hiroyuki Ito , Takeo Arikabe , Shyoji Watanabe , Shigenori Nagashima
- Applicant Address: JP Tokyo JP Ishikawa
- Assignee: Komatsu Ltd.,Komatsu Industries Corporation
- Current Assignee: Komatsu Ltd.,Komatsu Industries Corporation
- Current Assignee Address: JP Tokyo JP Ishikawa
- Agency: Global IP Counselors, LLP
- Priority: JP2008-134819 20080522
- International Application: PCT/JP2009/058636 WO 20090507
- International Announcement: WO2009/142112 WO 20091126
- Main IPC: B21J9/18
- IPC: B21J9/18 ; B21D24/10 ; B21D24/02
Abstract:
A die cushion device includes a cushion pad, a support section, a servomotor, and a shock absorber device. The support section supports the cushion pad. The servomotor raises and lowers the support section for raising and lowering the cushion pad. The shock absorber device includes a damping section and relieves shock between the cushion pad and the support section. The damping section generates reaction force in accordance with the relative speed of the cushion pad with respect to the support section.
Public/Granted literature
- US20110036140A1 DIE CUSHION DEVICE Public/Granted day:2011-02-17
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