Invention Grant
- Patent Title: Shipping platform
- Patent Title (中): 运输平台
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Application No.: US13716086Application Date: 2012-12-15
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Publication No.: US08850993B2Publication Date: 2014-10-07
- Inventor: John Thomas Storteboom , Oivind Brockmeier , Brandon M. D'Emidio , Timothy R. Proulx , Gregory S. Burkett , Jeffrey R. Chapin , Kenneth M. Brandt
- Applicant: CHEP Technology Pty Limited
- Applicant Address: AU Sydney NSW
- Assignee: Chep Technology Pty Limited
- Current Assignee: Chep Technology Pty Limited
- Current Assignee Address: AU Sydney NSW
- Agent Ido Tuchman
- Main IPC: B65D19/00
- IPC: B65D19/00 ; B65B45/00
Abstract:
A system may include structural components, and joining areas on the structural components where fasteners connect the structural components into a shipping platform. The system may also include a wrap positioned on each selected joining area of selected structural components where the fasteners connect the selected structural components together.
Public/Granted literature
- US20130175198A1 SHIPPING PLATFORM Public/Granted day:2013-07-11
Information query
