Invention Grant
US08851059B2 Self-cleaning wiresaw apparatus and method 有权
自清线装置及方法

Self-cleaning wiresaw apparatus and method
Abstract:
The present invention provides a self-cleaning wiresaw cutting apparatus including a cleaning mechanism adapted to clean the components of the wiresaw before, during, or after a cutting process or to humidify the cutting region of the apparatus. The apparatus contains at least one dispenser adapted to dispense an aqueous fluid onto various components of the wiresaw.
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