Invention Grant
US08851106B2 Gas supplying apparatus, cylinder cabinet provided with the same, valve box, and substrate process apparatus
有权
气体供给装置,具有该气体供给装置的气缸柜,阀箱和基板处理装置
- Patent Title: Gas supplying apparatus, cylinder cabinet provided with the same, valve box, and substrate process apparatus
- Patent Title (中): 气体供给装置,具有该气体供给装置的气缸柜,阀箱和基板处理装置
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Application No.: US13409327Application Date: 2012-03-01
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Publication No.: US08851106B2Publication Date: 2014-10-07
- Inventor: Tsuneyuki Okabe
- Applicant: Tsuneyuki Okabe
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2011-046490 20110303
- Main IPC: F16K31/00
- IPC: F16K31/00 ; H01L21/67 ; C23C16/455

Abstract:
A disclosed gas supplying apparatus includes a pressure controller that reduces a primary pressure thereby providing a secondary pressure greater than a process pressure at which a predetermined process is performed and less than the atmospheric pressure in a secondary pipe; a pressure sensor that measures a pressure in the secondary pipe; a first open/close valve provided in the secondary pipe; an open/close valve controller that opens or closes the first open/close valve; a pressure comparator that compares the pressure measured by the pressure sensor in the secondary pipe with a first set pressure that is greater than the process pressure by a predetermined pressure; and a controller that outputs a signal to the open/close valve controller thereby closing the first open/close valve, when the pressure comparator determines that the pressure in the secondary pipe is less than the first set pressure.
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