Invention Grant
- Patent Title: Method and apparatus of holding a device
- Patent Title (中): 握持装置的方法和装置
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Application No.: US12414861Application Date: 2009-03-31
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Publication No.: US08851133B2Publication Date: 2014-10-07
- Inventor: Martin Liu , Chung-Yi Yu , Che Ying Hsu , Yeur-Luen Tu , Da-Hsiang Chou , Chia-Shiung Tsai
- Applicant: Martin Liu , Chung-Yi Yu , Che Ying Hsu , Yeur-Luen Tu , Da-Hsiang Chou , Chia-Shiung Tsai
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: C23C16/50
- IPC: C23C16/50 ; C23C16/00 ; C23F1/00 ; H01L21/306 ; H01L21/683
Abstract:
Provided is an apparatus and a method of holding a device. The apparatus includes a wafer chuck having first and second holes that extend therethrough, and a pressure control structure that can independently and selectively vary a fluid pressure in each of the first and second holes between pressures above and below an ambient pressure. The method includes providing a wafer chuck having first and second holes that extend therethrough, and independently and selectively varying a fluid pressure in each of the first and second holes between pressures above and below an ambient pressure.
Public/Granted literature
- US20100248446A1 METHOD AND APPARATUS OF HOLDING A DEVICE Public/Granted day:2010-09-30
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