Invention Grant
- Patent Title: Method and pattern of dispensing thermal interface materials
- Patent Title (中): 分配热界面材料的方法和图案
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Application No.: US12628157Application Date: 2009-11-30
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Publication No.: US08851159B1Publication Date: 2014-10-07
- Inventor: Drew A. Davidson , Bahgat G. Sammakia
- Applicant: Drew A. Davidson , Bahgat G. Sammakia
- Applicant Address: US NY Binghamton
- Assignee: The Research Foundation for The State University of New York
- Current Assignee: The Research Foundation for The State University of New York
- Current Assignee Address: US NY Binghamton
- Agency: Ostrolenk Faber LLP
- Agent Steven M. Hoffberg
- Main IPC: A61C5/06
- IPC: A61C5/06

Abstract:
An interface is formed by pressing a first surface and a second surface together, with a particle-loaded thermal interface material (TIM) in between. By applying the thermal interface material to controlled locations on the first surface in controlled amounts, final layer thickness at a given squeezing pressure, and time required to squeeze, are minimized. The locations and amounts are controlled such that small islands of TIM merge only just before final layer thickness is achieved. Better TIM thermal performance and quicker manufacturing result.
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