Invention Grant
- Patent Title: Surgical cutting instrument that analyzes tissue thickness
- Patent Title (中): 手术切割仪器，分析组织厚度
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Application No.: US12647134Application Date: 2009-12-24
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Publication No.: US08851354B2Publication Date: 2014-10-07
- Inventor: Brett E. Swensgard , Bret W. Smith , Ryan J. Laurent
- Applicant: Brett E. Swensgard , Bret W. Smith , Ryan J. Laurent
- Applicant Address: US OH Cincinnati
- Assignee: Ethicon Endo-Surgery, Inc.
- Current Assignee: Ethicon Endo-Surgery, Inc.
- Current Assignee Address: US OH Cincinnati
- Main IPC: A61B17/04
- IPC: A61B17/04 ; A61B17/10 ; A61B17/00 ; A61B19/00 ; A61B17/072 ; A61B18/14 ; A61B17/32
Abstract:
A surgical instrument with a tissue-clamping end effector, where actuation of the instrument is locked out when the thickness of the tissue clamped in the end effector is not within a specified thickness range. The end effector may comprise a tissue thickness module that senses the thickness of the tissue clamped in the end effector. The surgical instrument also comprises a control circuit in communication with the tissue thickness module. The control circuit prevents actuation of a working portion of the end effector when the thickness of the tissue clamped in the end effector is not within the specified thickness range.
Public/Granted literature
- US20110155781A1 SURGICAL CUTTING INSTRUMENT THAT ANALYZES TISSUE THICKNESS Public/Granted day:2011-06-30
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