Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
- Patent Title (中): 液体喷头和液体喷射装置
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Application No.: US13850491Application Date: 2013-03-26
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Publication No.: US08851621B2Publication Date: 2014-10-07
- Inventor: Masahiko Sato , Munehide Kanaya , Toshinobu Yamazaki
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2012-074300 20120328
- Main IPC: B41J2/015
- IPC: B41J2/015 ; H05K1/00 ; B41J2/14
Abstract:
A liquid ejecting head has a flow channel substrate, an actuator formed on the flow channel substrate and having at least one mount, and a flexible wiring substrate electrically connected to the mount to supply a drive signal to the actuator. The mount of the actuator and the wiring substrate are bonded together using an epoxy adhesive agent containing p-aminophenol epoxy resin, bisphenol A epoxy resin, and bisphenol F epoxy resin.
Public/Granted literature
- US20130258001A1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS Public/Granted day:2013-10-03
Information query
IPC分类:
