Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
- Patent Title (中): 液体喷头和液体喷射装置
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Application No.: US13560278Application Date: 2012-07-27
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Publication No.: US08851631B2Publication Date: 2014-10-07
- Inventor: Jiro Kato , Ichiro Asaoka , Mitsuhiro Wada , Satoshi Denda
- Applicant: Jiro Kato , Ichiro Asaoka , Mitsuhiro Wada , Satoshi Denda
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2011-166461 20110729
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16
Abstract:
The liquid ejecting head includes a nozzle plate in which nozzle holes which are through holes are formed, and ejects liquid from the nozzle holes. The nozzle hole has a first nozzle portion which is opened to an ejection surface to which liquid is ejected from nozzles of the nozzle plate, and a second nozzle portion which communicates with the first nozzle portion, and is opened to a surface opposite to the ejection surface of the nozzle plate, and of which the opening diameter is larger than the opening diameter in the ejection surface of the first nozzle portion. The first nozzle portion is covered with a liquid repellent film which has higher liquid repellency than a base material of the nozzle plate and an inner wall of the second nozzle portion is provided with a region which has lower liquid repellency than the liquid repellent film.
Public/Granted literature
- US20130027470A1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS Public/Granted day:2013-01-31
Information query
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