Invention Grant
- Patent Title: Light emitting module with heatsink plate having coupling protrusions
- Patent Title (中): 具有散热板的发光模块具有耦合突起
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Application No.: US13372857Application Date: 2012-02-14
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Publication No.: US08851736B2Publication Date: 2014-10-07
- Inventor: Song Eun Lee , Bong Kul Min , Kyung Ho Shin , Ki Bum Kim
- Applicant: Song Eun Lee , Bong Kul Min , Kyung Ho Shin , Ki Bum Kim
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2011-0087405 20110830; KR10-2011-0103173 20111010; KR10-2011-0104156 20111012
- Main IPC: F21V7/04
- IPC: F21V7/04 ; B60Q1/06 ; F21V29/00 ; H05K1/02

Abstract:
Provided are a light emitting module and a backlight unit. The light emitting module comprises a module board comprising a plurality of first and second pads and a plurality of protrusion holes, a heatsink plate corresponding to a second surface opposite to a first surface of the module board, the heatsink plate comprising a plurality of protrusions respectively inserted into the protrusion holes of the module board, and a plurality of light emitting devices, each comprising a heatsink frame connected to the protrusions of the heatsink plate which comprises a first frame part on which the plurality of protrusions are disposed and a second frame part folded from the first frame part and disposed under the module board.
Public/Granted literature
- US20130051062A1 LIGHT EMITTING MODULE AND BACKLIGHT UNIT HAVING THE SAME Public/Granted day:2013-02-28
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