发明授权
- 专利标题: Light emitting module with heatsink plate having coupling protrusions
- 专利标题(中): 具有散热板的发光模块具有耦合突起
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申请号: US13372857申请日: 2012-02-14
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公开(公告)号: US08851736B2公开(公告)日: 2014-10-07
- 发明人: Song Eun Lee , Bong Kul Min , Kyung Ho Shin , Ki Bum Kim
- 申请人: Song Eun Lee , Bong Kul Min , Kyung Ho Shin , Ki Bum Kim
- 申请人地址: KR Seoul
- 专利权人: LG Innotek Co., Ltd.
- 当前专利权人: LG Innotek Co., Ltd.
- 当前专利权人地址: KR Seoul
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 优先权: KR10-2011-0087405 20110830; KR10-2011-0103173 20111010; KR10-2011-0104156 20111012
- 主分类号: F21V7/04
- IPC分类号: F21V7/04 ; B60Q1/06 ; F21V29/00 ; H05K1/02
摘要:
Provided are a light emitting module and a backlight unit. The light emitting module comprises a module board comprising a plurality of first and second pads and a plurality of protrusion holes, a heatsink plate corresponding to a second surface opposite to a first surface of the module board, the heatsink plate comprising a plurality of protrusions respectively inserted into the protrusion holes of the module board, and a plurality of light emitting devices, each comprising a heatsink frame connected to the protrusions of the heatsink plate which comprises a first frame part on which the plurality of protrusions are disposed and a second frame part folded from the first frame part and disposed under the module board.
公开/授权文献
- US20130051062A1 LIGHT EMITTING MODULE AND BACKLIGHT UNIT HAVING THE SAME 公开/授权日:2013-02-28
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