Invention Grant
- Patent Title: Hygrometer and dew-point instrument
- Patent Title (中): 湿度计和露点仪
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Application No.: US13557531Application Date: 2012-07-25
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Publication No.: US08851745B2Publication Date: 2014-10-07
- Inventor: Shinichirou Sakami
- Applicant: Shinichirou Sakami
- Applicant Address: JP Osaka
- Assignee: Espec Corp.
- Current Assignee: Espec Corp.
- Current Assignee Address: JP Osaka
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: JP2007-098022 20070404
- Main IPC: G01N25/26
- IPC: G01N25/26 ; G01N25/66 ; G01N25/56 ; G01N25/64

Abstract:
A hygrometer and dew-point instrument is provided that is structurally simple while reducing the workload during maintenance. The hygrometer measures relative humidity of a measurement space, and has a main body that encapsulates a working fluid therein and causes a heat-pipe phenomenon. The main body is disposed across the measurement space and an external space spaced from the measurement space by a heat-insulating part and has a temperature lower than the measurement space. A first temperature deriving part derives the temperature of the main body in a section where the working fluid evaporates. A space temperature detecting unit detects the temperature of the measurement space. A computation unit calculate relative humidity of the measurement space based on the temperature of the main body derived by the first temperature deriving part and the temperature of the measurement space detected by the space temperature detecting unit.
Public/Granted literature
- US20120287961A1 HYGROMETER AND DEW-POINT INSTRUMENT Public/Granted day:2012-11-15
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