Invention Grant
- Patent Title: Thermal conductivity measurement apparatus for one-dimensional material
- Patent Title (中): 一维材料热导率测量装置
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Application No.: US13869965Application Date: 2013-04-25
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Publication No.: US08851747B2Publication Date: 2014-10-07
- Inventor: Qing-Wei Li , Chang-Hong Liu , Shou-Shan Fan
- Applicant: Tsinghua University , Hon Hai Precision Industry Co., Ltd.
- Applicant Address: CN Beijing TW New Taipei
- Assignee: Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Beijing TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN2009101074016 20090508
- Main IPC: G01K1/08
- IPC: G01K1/08 ; G01N25/18
Abstract:
A thermal conductivity measurement apparatus for measuring a thermal conductivity of a one-dimensional material includes a substrate, a vacuum chamber receiving the substrate and four spaced electrodes. The one-dimensional material spans across the four spaced electrodes. A middle part of the one-dimensional material, located between the second and third electrodes, is suspended.
Public/Granted literature
- US20130235900A1 THERMAL CONDUCTIVITY MEASUREMENT APPARATUS FOR ONE-DIMENSIONAL MATERIAL Public/Granted day:2013-09-12
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