发明授权
- 专利标题： Thermal conductivity measurement apparatus for one-dimensional material
- 专利标题（中）： 一维材料热导率测量装置
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申请号： US13869965申请日： 2013-04-25
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公开(公告)号： US08851747B2公开(公告)日： 2014-10-07
- 发明人: Qing-Wei Li , Chang-Hong Liu , Shou-Shan Fan
- 申请人： Tsinghua University , Hon Hai Precision Industry Co., Ltd.
- 申请人地址： CN Beijing TW New Taipei
- 专利权人： Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人： Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址： CN Beijing TW New Taipei
- 代理机构： Novak Druce Connolly Bove + Quigg LLP
- 优先权： CN2009101074016 20090508
- 主分类号： G01K1/08
- IPC分类号： G01K1/08 ; G01N25/18
摘要：
A thermal conductivity measurement apparatus for measuring a thermal conductivity of a one-dimensional material includes a substrate, a vacuum chamber receiving the substrate and four spaced electrodes. The one-dimensional material spans across the four spaced electrodes. A middle part of the one-dimensional material, located between the second and third electrodes, is suspended.
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