Invention Grant
- Patent Title: Thermal detector, thermal detector device, electronic instrument, and method of manufacturing thermal detector
- Patent Title (中): 热探测器，热探测器，电子仪器和热探测器的制造方法
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Application No.: US13013040Application Date: 2011-01-25
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Publication No.: US08851748B2Publication Date: 2014-10-07
- Inventor: Takafumi Noda
- Applicant: Takafumi Noda
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JP2010-014177 20100126
- Main IPC: G01J5/02
- IPC: G01J5/02 ; G01J5/10 ; G01J5/34
Abstract:
The thermal detector includes a substrate, a thermal detector element including a light absorbing film, a support member supporting the thermal detector element and supported on the substrate so that a cavity is present between the member and the substrate, and at least one auxiliary support post of convex shape protruding from either the substrate or the support member towards the other. The height of the at least one auxiliary support post is shorter than the maximum height from the substrate to the support member.
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