Invention Grant
- Patent Title: Substrate processing method
- Patent Title (中): 基板加工方法
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Application No.: US14132592Application Date: 2013-12-18
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Publication No.: US08851769B2Publication Date: 2014-10-07
- Inventor: Koji Kaneyama
- Applicant: Koji Kaneyama
- Applicant Address: JP
- Assignee: Sokudo Co., Ltd.
- Current Assignee: Sokudo Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2010-072721 20100326
- Main IPC: G03D5/00
- IPC: G03D5/00 ; B05C13/02 ; G03B27/58 ; H01L21/677 ; H01L21/687 ; H01L21/67 ; G03F7/20

Abstract:
A substrate processing method for a substrate having a photosensitive film on a top surface thereof, includes cleaning a back surface of the substrate after the formation of the photosensitive film and before exposure processing; transporting the substrate to a temperature adjuster such as a cooling unit, while holding the substrate with a first holder; adjusting a temperature of the substrate with the temperature adjuster; transporting the substrate from the temperature adjuster to the exposure device with a second holder; and transporting the substrate after the exposure processing to a first platform while holding the substrate with a third holder.
Public/Granted literature
- US20140104586A1 SUBSTRATE PROCESSING METHOD Public/Granted day:2014-04-17
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