Invention Grant
- Patent Title: Oral implant placement system and method
- Patent Title (中): 口腔植入放置系统及方法
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Application No.: US13902347Application Date: 2013-05-24
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Publication No.: US08851888B2Publication Date: 2014-10-07
- Inventor: Gary A. Duncan
- Applicant: Immediate Implant Technologies, LLC
- Applicant Address: US OH Dublin
- Assignee: Immediate Implent Technologies, LLC
- Current Assignee: Immediate Implent Technologies, LLC
- Current Assignee Address: US OH Dublin
- Agency: Eley Law Firm Co., LPA
- Agent James R. Eley; Michael A. Forhan
- Main IPC: A61C19/04
- IPC: A61C19/04 ; A61C1/08 ; A61C8/00

Abstract:
An oral implant system and method. The system includes a positioning tool, a transfer band, a transfer screw, and a transfer drill to provide for accurate placement of a dental implant parallel to other implants and or existing teeth and at predetermined depths. A model is made of the patient's maxilla and mandible. The model is marked for implant position, depth and size. Holes are drilled in the model for implant analogs using the positioning tool. The analogs are installed into the model using the positioning tool and a surveyor. Transfer bands are coupled to the analogs and a surgical stent portion is fabricated. The surgical stent is fitted to the patient's occlusion, secured, and then utilized to accurately drill apertures into the patient's maxilla or mandible. The implants are installed into the apertures and the surgical stent is removed. A final restoration is secured to the implants.
Public/Granted literature
- US20130260337A1 Oral Implant Placement System and Method Public/Granted day:2013-10-03
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