Invention Grant
- Patent Title: Modular connector for a cable-less patching device
- Patent Title (中): 用于无线修补装置的模块化连接器
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Application No.: US13520832Application Date: 2011-01-06
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Publication No.: US08851902B2Publication Date: 2014-10-07
- Inventor: Pinchas Shifris , Alex Shar , Tzion Priav
- Applicant: Pinchas Shifris , Alex Shar , Tzion Priav
- Applicant Address: IL Tel Aviv
- Assignee: RIT Technologies Ltd.
- Current Assignee: RIT Technologies Ltd.
- Current Assignee Address: IL Tel Aviv
- Agency: Pearl Cohen Zedek Latzer Baratz LLP
- International Application: PCT/IL2011/000014 WO 20110106
- International Announcement: WO2011/083470 WO 20110714
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R13/60 ; H01R24/00 ; H01R13/66 ; H01R13/703 ; H01R24/64 ; H01R31/06 ; H01R12/71

Abstract:
Embodiments of the present invention are directed to a modular jack or modular connector mountable on a patch panel and having two openings. A first opening may receive a standard modular plug and a second opening may enable access to the resilient part of the conductive contacts inside the jack by a conductive element. The conductive element may electrically connect the connector to a second connector. The connector may be disconnected from the second connector when a communication plug is inserted into the first opening of the connector.
Public/Granted literature
- US20130130516A1 MODULAR CONNECTOR FOR A CABLE-LESS PATCHING DEVICE Public/Granted day:2013-05-23
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