Invention Grant
- Patent Title: Terminal connection structure
- Patent Title (中): 端子连接结构
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Application No.: US13890858Application Date: 2013-05-09
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Publication No.: US08851938B2Publication Date: 2014-10-07
- Inventor: Naoto Taguchi , Masaru Shimizu
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2010-254810 20101115
- Main IPC: H01R13/187
- IPC: H01R13/187 ; H01R4/48 ; H01R13/11 ; H01H85/143 ; H01R13/15 ; H01H85/20 ; H01H85/055

Abstract:
A terminal connection structure comprises a first terminal made in a plate shape and formed with a through-opening, a supporting section supporting the first terminal, a second terminal made in a plate shape and to be a connection counterpart of the first terminal, and a clip made of a plate-like material having an electrical conductivity, and having a central piece formed into a U-shape and opposed pieces continued from the central piece, the central piece being provided with a pair of projection portions projected from both side portions of the central piece to prevent the clip from excessively entering into the through-opening. The first terminal is interposed between the opposed pieces facing to each other with the central piece inserted into the through-opening, and the second terminal is inserted between a surface of the first terminal facing the pair of projection portions and the clip.
Public/Granted literature
- US20130244508A1 TERMINAL CONNECTION STRUCTURE Public/Granted day:2013-09-19
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