Invention Grant
- Patent Title: Solder-less electrical connection
- Patent Title (中): 无焊接电气连接
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Application No.: US13682526Application Date: 2012-11-20
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Publication No.: US08851939B2Publication Date: 2014-10-07
- Inventor: Mark A. Bazenas , Daniel J. Hawkins , Chester P. Piechowiak
- Applicant: Teledyne Instruments, Inc.
- Applicant Address: US CA Thousand Oaks
- Assignee: Teledyne Instruments, Inc.
- Current Assignee: Teledyne Instruments, Inc.
- Current Assignee Address: US CA Thousand Oaks
- Agency: Procopio Cory Hargreaves & Savitch LLP
- Main IPC: H01R13/33
- IPC: H01R13/33 ; H01R13/523 ; H01R13/187 ; H01R4/20 ; H01R13/11 ; F16F1/04

Abstract:
A solder-less wire connector sleeve of conductive material has a first bore portion extending from a first end and configured for rotatable connection to an end portion of an electrical rod or pin of a subsea connector or the like, and a second bore portion extending from the second end and configured for receiving a wire. The sleeve has a crimp portion overlying the wire receiving end portion. An annular, resilient, snap engaging member is mounted in the first bore portion to extend radially inwardly into the bore, and is configured for resilient, snap engagement in an annular groove in the conductor rod adjacent the tip of the rod to retain the rod in the sleeve while permitting relative rotation between the rod and sleeve.
Public/Granted literature
- US20140141658A1 SOLDER-LESS ELECTRICAL CONNECTION Public/Granted day:2014-05-22
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