Invention Grant
- Patent Title: Crimping terminal and manufacturing of same
- Patent Title (中): 压接端子和制造相同
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Application No.: US13640810Application Date: 2011-04-12
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Publication No.: US08851941B2Publication Date: 2014-10-07
- Inventor: Masanori Onuma
- Applicant: Masanori Onuma
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-092133 20100413
- International Application: PCT/JP2011/059094 WO 20110412
- International Announcement: WO2011/129333 WO 20111020
- Main IPC: H01R4/10
- IPC: H01R4/10 ; H01R4/18 ; H01R43/16

Abstract:
Disclosed is a crimping terminal that suppresses as far as possible an increase in contact resistance with an electrical wire even in a severe thermal impact environment. A crimping terminal is formed into a substantial U-shape section with a bowed bottom plate. Also, a bead is formed whose in inner surface is made convex by punching a concave shape from an outer surface of a wall plate, on the wall plate at any position in a range from at least a bottom plate to a conductor swage piece. A work hardening portion hardened by crushing at a center portion in a width direction of the bottom plate is also formed.
Public/Granted literature
- US20130035007A1 CRIMPING TERMINAL AND MANUFACTURING OF SAME Public/Granted day:2013-02-07
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