Invention Grant
- Patent Title: Method of bonding a metal to a substrate
- Patent Title (中): 将金属键合到基底的方法
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Application No.: US13310110Application Date: 2011-12-02
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Publication No.: US08852359B2Publication Date: 2014-10-07
- Inventor: Michael J. Walker , Anil K. Sachdev , Bob R. Powell, Jr. , Aihua A. Luo
- Applicant: Michael J. Walker , Anil K. Sachdev , Bob R. Powell, Jr. , Aihua A. Luo
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Agency: Dierker & Associates, P.C.
- Main IPC: C23C22/70
- IPC: C23C22/70 ; C23C22/56 ; C25D11/04

Abstract:
A method of bonding a metal to a substrate involves forming an oxide layer on a surface of the substrate, and in a molten state, over-casting the metal on the substrate surface. The over-casting drives a reaction at an interface between the over-cast metal and the oxide layer to form another oxide. The other oxide binds the metal to the substrate surface upon solidification of the over-cast metal.
Public/Granted literature
- US20120301734A1 METHOD OF BONDING A METAL TO A SUBSTRATE Public/Granted day:2012-11-29
Information query
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