Invention Grant
- Patent Title: Wet processing using a fluid meniscus apparatus
- Patent Title (中): 使用流体弯液面装置进行湿法加工
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Application No.: US11582195Application Date: 2006-10-16
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Publication No.: US08852383B2Publication Date: 2014-10-07
- Inventor: Ricardo I. Fuentes
- Applicant: Ricardo I. Fuentes
- Applicant Address: US NY Poughkeepsie
- Assignee: Materials and Technologies Corporation
- Current Assignee: Materials and Technologies Corporation
- Current Assignee Address: US NY Poughkeepsie
- Agency: Kenyon & Kenyon LLP
- Main IPC: H01L21/306
- IPC: H01L21/306 ; H01L21/67 ; C25D5/02 ; C23C18/16
Abstract:
A wet processing apparatus and method that takes advantage of a fluid meniscus to process at least a portion of a surface of an object. After one surface of the object has been processed another side or surface of the object can be similarly processed. This processing can be coating, etching, plating, to name a few. An application of the apparatus and method is in the semiconductor processing industry, especially, the processing of wafers and substrates. The method and apparatus also allows the processing of multiple surfaces of an electronic component.
Public/Granted literature
- US20070084560A1 Wet processing using a fluid meniscus, apparatus and method Public/Granted day:2007-04-19
Information query
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