Invention Grant
- Patent Title: Plasma processing apparatus and shower head
- Patent Title (中): 等离子处理装置和淋浴头
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Application No.: US13036369Application Date: 2011-02-28
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Publication No.: US08852387B2Publication Date: 2014-10-07
- Inventor: Hachishiro Iizuka , Jun Abe , Akihiro Yokota , Takeshi Ohse
- Applicant: Hachishiro Iizuka , Jun Abe , Akihiro Yokota , Takeshi Ohse
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2010-044916 20100302
- Main IPC: H01L21/3065
- IPC: H01L21/3065 ; C23C16/455 ; C23F1/08 ; H05H1/24
Abstract:
There is provided a plasma processing apparatus including: a shower head installed within a processing chamber for processing a substrate and facing a mounting table for mounting the substrate; a multiple number of gas exhaust holes formed through the shower head to be extended from a facing surface of the shower head to an opposite surface to the facing surface; a multiple number of openable and closable trigger holes formed through the shower head to be extended from the facing surface of the shower head to the opposite surface, and configured to allow plasma leakage from the facing surface to the opposite surface; and a partition wall installed in a gas exhaust space provided on the side of the opposite surface of the shower head to divide the gas exhaust space into a multiple number of regions, each region communicating with one or more trigger holes.
Public/Granted literature
- US20110214814A1 PLASMA PROCESSING APPARATUS AND SHOWER HEAD Public/Granted day:2011-09-08
Information query
IPC分类:
