Invention Grant
- Patent Title: Sputtering apparatus
- Patent Title (中): 溅射装置
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Application No.: US13938289Application Date: 2013-07-10
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Publication No.: US08852411B2Publication Date: 2014-10-07
- Inventor: Wei-Cheng Ling
- Applicant: Hon Hai Precision Industry Co., Ltd.
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: TW99112640A 20100422
- Main IPC: C23C14/00
- IPC: C23C14/00 ; C25B11/00 ; C25B13/00 ; C23C14/56 ; H01J37/34 ; C23C14/50 ; C23C14/02 ; H01L21/67

Abstract:
A sputtering apparatus includes a support assembly and posts. The support assembly includes an upper base, a lower base, seat members, and connection posts interconnected between the upper base and the lower base. The upper base defines cutouts. The seat members are rotatably mounted on the lower base and aligned with the cutouts. Each seat member includes a hollow receiving post, a support post moveably received in the receiving post, a lever bar pivotably connected to the receiving post, and a drive post, the drive post and the support post are coupled to opposite ends of the lever bar. Each seat member is rotatable about a longitudinal axis of the receiving post. The posts fix workpieces in place. Each post includes a rod body portion having a first end and an opposite second end, an engagement portion at the first end, and a protrusion extending from the second end.
Public/Granted literature
- US20130299348A1 SPUTTERING APPARATUS Public/Granted day:2013-11-14
Information query
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