Invention Grant
- Patent Title: Light-reflective anisotropic conductive adhesive and light-emitting device
- Patent Title (中): 光反射各向异性导电胶和发光装置
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Application No.: US13805238Application Date: 2012-03-14
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Publication No.: US08852462B2Publication Date: 2014-10-07
- Inventor: Hideaki Umakoshi , Hidetsugu Namiki , Masaharu Aoki , Akira Ishigami , Shiyuki Kanisawa
- Applicant: Hideaki Umakoshi , Hidetsugu Namiki , Masaharu Aoki , Akira Ishigami , Shiyuki Kanisawa
- Applicant Address: JP Tokyo
- Assignee: Dexerials Corporation
- Current Assignee: Dexerials Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2011-057818 20110316
- International Application: PCT/JP2012/056520 WO 20120314
- International Announcement: WO2012/124724 WO 20120920
- Main IPC: H01B1/00
- IPC: H01B1/00 ; C08L83/00 ; H01L33/62 ; H01L33/60 ; H01B3/00 ; C08G77/38 ; C09J183/06 ; H01B1/22 ; H01L33/46 ; C09J9/02 ; C08K5/09 ; C08G77/12 ; C08K3/22 ; C08K5/00
Abstract:
A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a thermosetting resin composition containing a silicone resin and a curing agent, conductive particles and light-reflective insulating particles. The light-reflective insulating particle is at least one kind of inorganic particles selected from the group consisting of titanium oxide, boron nitride, zinc oxide, silicon oxide, and aluminum oxide. The silicone resin is a glycidyloxyalkyl-alicyclic alkyl-modified organopolysiloxane.
Public/Granted literature
- US20130087825A1 LIGHT-REFLECTIVE ANISOTROPIC CONDUCTIVE ADHESIVE AND LIGHT EMITTING DEVICE Public/Granted day:2013-04-11
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