Invention Grant
- Patent Title: Metal fine particle for conductive metal paste, conductive metal paste and metal film
- Patent Title (中): 金属微粒导电金属膏,导电金属膏和金属膜
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Application No.: US12968662Application Date: 2010-12-15
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Publication No.: US08852463B2Publication Date: 2014-10-07
- Inventor: Dai Ishikawa , Tomiya Abe
- Applicant: Dai Ishikawa , Tomiya Abe
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP2010-090357 20100409
- Main IPC: H01B1/22
- IPC: H01B1/22 ; H01B1/02 ; C23C8/34 ; B22F1/00

Abstract:
A metal fine particle for a conductive metal paste includes a protective agent covering a surface of the metal fine particle. An amount of heat generated per unit mass (g) of the metal fine particle is not less than 500 J at a temperature of an external heat source temperature in a range of 200° C. to 300° C. when being calcined by the external heat source. The protective agent includes at least one selected from the group consisting of dipropylamine, dibutylamine, triethylamine, tripropylamine, tributylamine, butanethiol, pentanethiol, hexanethiol, heptanethiol, octanethiol, nonanethiol, decanethiol, undecanethiol and dodecanethiol. The content of the protective agent is in a range of 0.1 to 20% by mass with respect to the mass of the metal fine particle.
Public/Granted literature
- US20110248221A1 METAL FINE PARTICLE FOR CONDUCTIVE METAL PASTE, CONDUCTIVE METAL PASTE AND METAL FILM Public/Granted day:2011-10-13
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