Invention Grant
- Patent Title: Low-stress molded gasket and method of making same
- Patent Title (中): 低应力模压垫片及其制作方法
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Application No.: US12445404Application Date: 2007-11-06
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Publication No.: US08852486B2Publication Date: 2014-10-07
- Inventor: T. Scott Tanner , Stefan Pitolaj
- Applicant: T. Scott Tanner , Stefan Pitolaj
- Applicant Address: US NY Palmyra
- Assignee: Garlock Sealing Technologies, LLC
- Current Assignee: Garlock Sealing Technologies, LLC
- Current Assignee Address: US NY Palmyra
- Agency: Perkins Coie LLP
- International Application: PCT/US2007/083827 WO 20071106
- International Announcement: WO2008/058153 WO 20080515
- Main IPC: B29C51/08
- IPC: B29C51/08 ; F16J15/10

Abstract:
A molded discrete low stress gasket is constructed of restructured filled PTFE for use in corrosive or severe chemical environments under relatively low bolt loads. The gasket has a gasket surface and includes a raised outer sealing ring and a raised inner sealing ring. The gasket may constructed from a restructured filled PTFE material, with the sealing rings deforming at lower pressures than the remaining portions of the gasket.
Public/Granted literature
- US20100155986A1 LOW-STRESS MOLDED GASKET AND METHOD OF MAKING SAME Public/Granted day:2010-06-24
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