Invention Grant
US08852513B1 Systems and methods for packaging integrated circuit gas sensor systems
有权
集成电路气体传感器系统封装的系统和方法
- Patent Title: Systems and methods for packaging integrated circuit gas sensor systems
- Patent Title (中): 集成电路气体传感器系统封装的系统和方法
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Application No.: US13250810Application Date: 2011-09-30
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Publication No.: US08852513B1Publication Date: 2014-10-07
- Inventor: Raymond Speer , Leon Cavanagh , Peter Smith , John Pavelka
- Applicant: Raymond Speer , Leon Cavanagh , Peter Smith , John Pavelka
- Applicant Address: US TX Austin
- Assignee: Silicon Laboratories Inc.
- Current Assignee: Silicon Laboratories Inc.
- Current Assignee Address: US TX Austin
- Agency: Egan, Peterman & Enders LLP.
- Main IPC: G01N27/403
- IPC: G01N27/403 ; G01N27/407
Abstract:
Systems and methods are provided for packaging integrated circuit (IC) gas sensor systems that employ at least one gas sensor that is formed as part of an integrated circuit and configured to sense the presence and/or concentration of a target gas or other gas characteristics that may be present in the ambient gaseous environment surrounding the packaged IC gas sensor system.
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