Invention Grant
- Patent Title: High-throughput combinatorial dip-coating methodologies for selecting particle-containing formulations and depositing contaminants on substrates
- Patent Title (中): 用于选择含有颗粒的配方和在基材上沉积污染物的高通量组合浸涂方法
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Application No.: US13160732Application Date: 2011-06-15
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Publication No.: US08852679B2Publication Date: 2014-10-07
- Inventor: Nikhil D. Kalyankar , Nitin Kumar , Zhi-Wen Sun , Kenneth A. Williams
- Applicant: Nikhil D. Kalyankar , Nitin Kumar , Zhi-Wen Sun , Kenneth A. Williams
- Applicant Address: US CA San Jose
- Assignee: Intermolecular, Inc.
- Current Assignee: Intermolecular, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: B05D1/24
- IPC: B05D1/24 ; B03B7/00 ; B03B13/00 ; B01J19/00 ; C40B30/00 ; C23C18/12 ; C40B60/12
Abstract:
Embodiments of the current invention describe a high performance combinatorial method and apparatus for the combinatorial development of coatings by a dip-coating process. The dip-coating process may be used for multiple applications, including forming coatings from varied sol-gel formulations, coating substrates uniformly with particles to combinatorially test particle removal formulations, and the dipping of substrates into texturing formulations to combinatorially develop the texturing formulations.
Public/Granted literature
- US20120156498A1 High-Throughput Combinatorial Dip-Coating Apparatus and Methodologies Public/Granted day:2012-06-21
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