Invention Grant
US08852698B2 Laser beam machining method, laser beam machining apparatus, and laser beam machining product
有权
激光束加工方法，激光束加工装置和激光束加工产品
- Patent Title: Laser beam machining method, laser beam machining apparatus, and laser beam machining product
- Patent Title (中): 激光束加工方法，激光束加工装置和激光束加工产品
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Application No.: US12585780Application Date: 2009-09-24
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Publication No.: US08852698B2Publication Date: 2014-10-07
- Inventor: Kenshi Fukumitsu
- Applicant: Kenshi Fukumitsu
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: Hamamatsu Photonics K.K.
- Current Assignee: Hamamatsu Photonics K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JPP2003-277039 20030718
- Main IPC: B23K26/38
- IPC: B23K26/38 ; H01L21/301 ; B23K26/06 ; B23K26/36 ; B23K26/03 ; B23K26/40 ; B28D1/22
Abstract:
It is an object to provide a laser beam machining method which can easily cut a machining target. The laser beam machining method irradiates laser light while positioning a focus point at the inside of a machining target to thereby form a treated area based on multiphoton absorption along a planned cutting line of the machining target inside the machining target and also form a minute cavity at a predetermined position corresponding to the treated area in the machining target.
Public/Granted literature
- US20100151202A1 Laser beam machining method, laser beam machining apparatus, and laser beam machining product Public/Granted day:2010-06-17
Information query
IPC分类:
