Invention Grant
- Patent Title: Packaging formed from a butt-welded film
- Patent Title (中): 由对接焊接膜形成的包装
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Application No.: US12296196Application Date: 2007-04-06
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Publication No.: US08852705B2Publication Date: 2014-10-07
- Inventor: Jacques Thomasset , Stéphane Mathieu
- Applicant: Jacques Thomasset , Stéphane Mathieu
- Applicant Address: CH Vouvry
- Assignee: Aisapack Holding S.A.
- Current Assignee: Aisapack Holding S.A.
- Current Assignee Address: CH Vouvry
- Agency: Nixon & Vanderhye P.C.
- Priority: WOPCT/IB2006/051052 20060406; EP06118170 20060731; EP06118199 20060731; WOPCT/IB2006/054420 20061124
- International Application: PCT/IB2007/051247 WO 20070406
- International Announcement: WO2007/113780 WO 20071011
- Main IPC: B32B27/32
- IPC: B32B27/32 ; B32B7/00 ; B32B37/00 ; B32B38/00 ; B29C65/44 ; B29C65/00 ; B32B7/12 ; B32B15/20 ; B29C65/50 ; B32B27/10 ; B32B27/36 ; B32B27/30 ; B32B27/00 ; B32B15/12 ; B32B27/08 ; B29C65/02 ; B32B15/08 ; B32B3/08 ; B29L9/00 ; B29K23/00 ; B29L23/20 ; B29K67/00 ; B29K305/02
Abstract:
Packaging produced from a thermoplastic film of which the ends are placed so that they abut, said film being composed of several layers, including at least a first weldable layer and a second layer of which the butt-welding is only partial or non-existent, and at least one thin strip covering said ends and being directly attached to one of the faces of the second layer, the difference in the melting point between the first layer and the other layer or layers being greater than 20° C.
Public/Granted literature
- US20090092792A1 PACKAGING FORMED FROM A BUTT-WELDED FILM Public/Granted day:2009-04-09
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