Invention Grant
- Patent Title: Melt-extruded substrate for use in thermoformed articles
- Patent Title (中): 用于热成型制品的熔融挤出基材
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Application No.: US13594919Application Date: 2012-08-27
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Publication No.: US08852730B2Publication Date: 2014-10-07
- Inventor: Kamlesh P. Nair , Steven D. Gray , Camilo Cano
- Applicant: Kamlesh P. Nair , Steven D. Gray , Camilo Cano
- Applicant Address: US KY Florence
- Assignee: Ticona LLC
- Current Assignee: Ticona LLC
- Current Assignee Address: US KY Florence
- Agency: Dority & Manning, P.A.
- Main IPC: C09K19/38
- IPC: C09K19/38 ; B29C43/24 ; C09K19/48 ; C09K19/32 ; C09K19/34 ; C09K19/30 ; C09K19/22 ; C08K5/20 ; C09K19/04

Abstract:
A melt-extruded substrate that can be readily thermoformed into a shaped, three-dimensional article is provided. The substrate is formed from a polymer composition that contains a thermotropic liquid crystalline polymer and a unique aromatic amide oligomer. The present inventors have discovered that the oligomer can help increase the “low shear” complex viscosity of the resulting polymer. The ability to achieve enhanced low shear viscosity values can lead to polymer compositions with an increased melt strength, which allows the resulting substrate to better maintain its shape during thermoforming without exhibiting a substantial amount of sag. Due to its relatively high degree of melt strength, the polymer composition is particularly well suited for forming thin extruded substrates for use in thermoforming processes.
Public/Granted literature
- US20130052446A1 Melt-Extruded Substrate for Use in Thermoformed Articles Public/Granted day:2013-02-28
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