Invention Grant
- Patent Title: Substrate coating and method of forming the same
- Patent Title (中): 基材涂层及其形成方法
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Application No.: US13046487Application Date: 2011-03-11
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Publication No.: US08852746B2Publication Date: 2014-10-07
- Inventor: Kit Ling Ng , Xin Chao Duan , Po Ching Chan , Winston Chan
- Applicant: Kit Ling Ng , Xin Chao Duan , Po Ching Chan , Winston Chan
- Applicant Address: HK Hong Kong
- Assignee: Winsky Technology Limited
- Current Assignee: Winsky Technology Limited
- Current Assignee Address: HK Hong Kong
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: TW099113912A 20100430
- Main IPC: B05D1/36
- IPC: B05D1/36 ; H05H1/24 ; B32B7/02 ; B32B9/00 ; B32B9/04 ; C23C16/32 ; C23C16/27 ; C23C30/00 ; C23C16/503

Abstract:
A substrate coating and a method of forming the same are provided. The substrate coating includes a first layer formed on a substrate, in which the composition of the first layer includes at least silicon-rich-carbon, and the amount of silicon is about equal to or greater than the amount of carbon; and a second layer formed on the first layer, in which the composition of the second layer includes at least fluorine doped diamond-like-carbon. The substrate coating not only is easy to clean, has good wearing performance, and provides a smooth surface, but also has better adhesion to prevent peeling off.
Public/Granted literature
- US20110268943A1 SUBSTRATE COATING AND METHOD OF FORMING THE SAME Public/Granted day:2011-11-03
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