Invention Grant
- Patent Title: Photomask and semiconductor apparatus manufacturing method
- Patent Title (中): 光掩模和半导体器件制造方法
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Application No.: US13770012Application Date: 2013-02-19
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Publication No.: US08852830B2Publication Date: 2014-10-07
- Inventor: Satoshi Hirayama , Atsushi Kanome
- Applicant: Canon Kabushiki Kaisha
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2012-039132 20120224
- Main IPC: G03F1/50
- IPC: G03F1/50 ; G03F7/20 ; G03F1/00

Abstract:
A photomask for exposing a region on a substrate, with a mask pattern, including a first line pattern, a second line pattern, a first connection pattern for a peripheral portion of the region and a second connection pattern for the peripheral portion, wherein the first connection pattern is wider than the first line pattern and the second connection pattern is wider than the second line pattern, a distance from a virtual line between the first line pattern and the second line pattern to a center line of the first connection pattern is larger than a distance from the virtual line to a center line of the first line pattern and a distance from the virtual line to a center line of the second connection pattern is larger than a distance from the virtual line to a center line of the second line pattern.
Public/Granted literature
- US20130224637A1 PHOTOMASK AND SEMICONDUCTOR APPARATUS MANUFACTURING METHOD Public/Granted day:2013-08-29
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