Invention Grant
- Patent Title: Composition for coating over a photoresist pattern
- Patent Title (中): 用于在光致抗蚀剂图案上涂覆的组合物
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Application No.: US12845236Application Date: 2010-07-28
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Publication No.: US08852848B2Publication Date: 2014-10-07
- Inventor: Hengpeng Wu , Meng Li , Yi Cao , Jian Yin , DongKwan Lee , SungEun Hong , Margareta Paunescu
- Applicant: Hengpeng Wu , Meng Li , Yi Cao , Jian Yin , DongKwan Lee , SungEun Hong , Margareta Paunescu
- Applicant Address: US NJ Somerville
- Assignee: Z Electronic Materials USA Corp.
- Current Assignee: Z Electronic Materials USA Corp.
- Current Assignee Address: US NJ Somerville
- Agent Sangya Jain
- Main IPC: G03F7/40
- IPC: G03F7/40 ; G03F7/075 ; C09D183/08 ; C09D183/06
Abstract:
The present invention relates to an aqueous composition for coating over a photoresist pattern comprising a first water soluble compound comprising at least a silicon moiety and at least one amino group, and a second compound comprising at least 1 carboxylic acid group. The invention further relates to processes for using the novel invention.
Public/Granted literature
- US20120028195A1 Composition for Coating over a Photoresist Pattern Public/Granted day:2012-02-02
Information query
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