Invention Grant
- Patent Title: Heat treatment method and heat treatment apparatus of thin film
- Patent Title (中): 薄膜的热处理方法和热处理装置
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Application No.: US13609947Application Date: 2012-09-11
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Publication No.: US08852966B2Publication Date: 2014-10-07
- Inventor: Hiroki Kiyama , Kazuhiko Fuse , Shinichi Kato
- Applicant: Hiroki Kiyama , Kazuhiko Fuse , Shinichi Kato
- Applicant Address: JP
- Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2011-209365 20110926; JP2012-153169 20120709
- Main IPC: H01L21/26
- IPC: H01L21/26 ; H01L21/02 ; H01L21/268 ; H01L21/67

Abstract:
A semiconductor wafer, on the surface of which a silicon dioxide base material and an amorphous silicon thin film are formed in this order, is carried into a chamber. An insulated gate bipolar transistor (IGBT) is connected with a power supply circuit to a flash lamp, and the IGBT makes an energization period to the flash lamp to be 0.01 millisecond or more and 1 millisecond or less, consequently making a flash light irradiation time to be 0.01 millisecond or more and 1 millisecond or less. Since a flash heat treatment is performed with a remarkably short flash light irradiation time, the excessive heating of the thin film of amorphous silicon is suppressed and harmful influence such as the exfoliation of the film is prevented.
Public/Granted literature
- US20130078744A1 HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS OF THIN FILM Public/Granted day:2013-03-28
Information query
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