Invention Grant
- Patent Title: Method for mounting luminescent device
- Patent Title (中): 发光装置的安装方法
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Application No.: US13137855Application Date: 2011-09-19
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Publication No.: US08852970B2Publication Date: 2014-10-07
- Inventor: Shota Shimonishi , Hiroyuki Tajima , Yosuke Tsuchiya
- Applicant: Shota Shimonishi , Hiroyuki Tajima , Yosuke Tsuchiya
- Applicant Address: TW Kiyosu-Shi, Aichi-Ken
- Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee Address: TW Kiyosu-Shi, Aichi-Ken
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2010-210400 20100921
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/00 ; H01L23/00 ; H01L33/46
Abstract:
A method for mounting a luminescent device having a mount layer on a substrate, comprising the steps of coating a metallic nano-particle paste on the substrate, disposing the mount layer of the luminescent device on the metallic nano-particle paste, and heating the mount layer and the metallic nano-particle paste to form an alloy, thereby bonding the luminescent device and the substrate.
Public/Granted literature
- US20120070920A1 Method for mounting luminescent device Public/Granted day:2012-03-22
Information query
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