Invention Grant
- Patent Title: Method of cutting light emitting element packages employing ceramic substrate, and method of cutting multilayered object
- Patent Title (中): 使用陶瓷基板切割发光元件封装的方法以及切割多层物体的方法
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Application No.: US13408433Application Date: 2012-02-29
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Publication No.: US08852971B2Publication Date: 2014-10-07
- Inventor: Eui-seok Kim , Won-soo Ji , Choo-ho Kim , Shin-min Rhee , Dong-hun Lee , Hee-young Jun
- Applicant: Eui-seok Kim , Won-soo Ji , Choo-ho Kim , Shin-min Rhee , Dong-hun Lee , Hee-young Jun
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0104829 20111013
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L21/00 ; H01L33/00 ; B23K26/40 ; B23K26/00
Abstract:
A method of cutting light emitting element packages includes preparing a ceramic substrate having a surface on which a plurality of light emitting element chips are mounted and a light-transmitting material layer is formed to cover the plurality of light emitting element chips; partially removing the light-transmitting material layer between the plurality of light emitting element chips along a cutting line by using a mechanical cutting method; and separating individual light emitting element packages by cutting the ceramic substrate along the cutting line by using a laser cutting method.
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