Invention Grant
- Patent Title: Method for manufacturing semiconductor light emitting device
- Patent Title (中): 半导体发光元件的制造方法
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Application No.: US14081688Application Date: 2013-11-15
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Publication No.: US08852976B2Publication Date: 2014-10-07
- Inventor: Hiroshi Hamasaki , Akihiro Kojima , Yoshiaki Sugizaki
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: White & Case LLP
- Priority: JP2009-180402 20090803
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/00 ; H01L33/38 ; H01L33/36

Abstract:
According to one embodiment, a semiconductor light emitting device includes a semiconductor layer including a first surface, a second surface opposite to the first surface, and a light emitting layer; a p-side electrode provided on the second surface of the semiconductor layer in a region including the light emitting layer; an n-side electrode provided on the second surface of the semiconductor layer in a region not including the light emitting layer; an insulating film being more flexible than the semiconductor layer, the insulating film provided on the second surface and a side surface of the semiconductor layer, and the insulating film having a first opening reaching the p-side electrode and a second opening reaching the n-side electrode; a p-side interconnection layer provided on the insulating film and connected to the p-side electrode; and an n-side interconnection layer provided on the insulating film and connected to the n-side electrode.
Public/Granted literature
- US20140070264A1 METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE Public/Granted day:2014-03-13
Information query
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