Invention Grant
US08852986B2 Integrated circuit package system employing resilient member mold system technology
有权
集成电路封装系统采用弹性元件模具系统技术
- Patent Title: Integrated circuit package system employing resilient member mold system technology
- Patent Title (中): 集成电路封装系统采用弹性元件模具系统技术
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Application No.: US11749717Application Date: 2007-05-16
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Publication No.: US08852986B2Publication Date: 2014-10-07
- Inventor: Heap Hoe Kuan , Pei Ee Chua , Seng Guan Chow
- Applicant: Heap Hoe Kuan , Pei Ee Chua , Seng Guan Chow
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L23/31
- IPC: H01L23/31
Abstract:
An integrated circuit package system that includes: providing a support structure including a device and an electrical contact adjacent thereto; providing a mold system having a cavity, a recess channel, a recess integrally connected to the recess channel, and a resilient member that cooperatively engages the recess channel and the recess; engaging the mold system and the support structure with the cavity over the device and the resilient member between the device and the electrical contact; and injecting encapsulation material into the cavity.
Public/Granted literature
- US20080284066A1 INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING RESILIENT MEMBER MOLD SYSTEM TECHNOLOGY Public/Granted day:2008-11-20
Information query
IPC分类:
