Invention Grant
- Patent Title: System-in-a-package based flash memory card
- Patent Title (中): 基于系统的包装闪存卡
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Application No.: US13235852Application Date: 2011-09-19
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Publication No.: US08852999B2Publication Date: 2014-10-07
- Inventor: Hem Takiar , Robert C. Miller , Warren Middlekauff , Michael W. Patterson , Shrikar Bhagath
- Applicant: Hem Takiar , Robert C. Miller , Warren Middlekauff , Michael W. Patterson , Shrikar Bhagath
- Applicant Address: US TX Plano
- Assignee: SanDisk Technologies Inc.
- Current Assignee: SanDisk Technologies Inc.
- Current Assignee Address: US TX Plano
- Agency: Vierra Magen Marcus LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/00 ; G06K19/077 ; H01L25/16 ; H01L21/56 ; H01L25/065 ; G11C5/04 ; H01L23/31 ; H01L31/0203 ; H01L23/29 ; H01L23/28 ; H01L21/50 ; H01L23/00 ; H05K3/00 ; H05K1/18

Abstract:
A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
Public/Granted literature
- US20120009732A1 SYSTEM-IN-A-PACKAGE BASED FLASH MEMORY CARD Public/Granted day:2012-01-12
Information query
IPC分类: