Invention Grant
- Patent Title: Method of manufacturing semiconductor device
- Patent Title (中): 制造半导体器件的方法
-
Application No.: US13784238Application Date: 2013-03-04
-
Publication No.: US08853004B2Publication Date: 2014-10-07
- Inventor: Junji Sakakibara , Takehiko Ikegami
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Mattingly & Malur, PC
- Priority: JP2012-052583 20120309
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/00

Abstract:
Disclosed is a technique in which an excessive resin can be stably cut and removed in a molding step. In a step for separating part of a runner leading to a resin-sealing body from the resin-sealing body, the runner is formed by a first runner and a second runner coupled to the first runner and the resin-sealing body. The runner is separated from a middle of the second runner by supporting, with a first supporting portion, the second runner from the side of the second surface of a lead frame, and by pushing down, with a break pin, the first runner in the direction from the side of the first surface of the lead frame toward the side of the second surface thereof, while the resin-sealing body is in a condition of floating in the air.
Public/Granted literature
- US20130237014A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2013-09-12
Information query
IPC分类: